IEEE Fellow, Prof. Fan-Tien Cheng, National Cheng Kung University, Taiwan

Speech Title: Advanced Manufacturing Cloud of Things (Industry 4.0 + AVM = Industry 4.1) 

Abstract: Virtual Metrology (VM) is a method to conjecture manufacturing quality of a process tool based on data sensed from the process tool and without physical metrology operations. In other words, VM can convert sampling inspection with metrology delay into real-time and on-line total inspection. This talk will first introduce the theories and functions of the Automatic Virtual Metrology (AVM) system and then demonstrate how to apply AVM to high-tech (semiconductor, TFT-LCD, etc.) and traditional machine-tool (automobile wheel machining, airplane engine casing, etc.) industries. The current Industry 4.0 platform can only keep the faith of achieving the nearly Zero-Defects state without realizing this goal. In other words, Industry 4.0 only emphasizes "Enhancing Productivity" but not "Improving Quality". The key reason for this inability is the lack of an affordable online and real-time total inspection system. The Zero-Defects state can be achieved by adopting the AVM system due to its capability of providing all products total inspection data. As the AVM system is integrated with the Industry 4.0 platform, the goal of Zero-Defects can be accomplished, which is defined as "Industry 4.1." This talk then focuses on how to utilize Internet of Things (IoT), Big Data Analysis, Cloud Manufacturing (CM), and Cyber Physical Systems (CPS) along with the AVM technology to develop an Advanced Manufacturing Cloud of Things (AMCoT) that construct a smart manufacturing platform for achieving the goals of Industry 4.1.

Biography: Soon after Fan-Tien Cheng graduated from the department of Electrical Engineering of National Cheng Kung University (NCKU) in 1976, he got in the Chung Shan Institute of Science and Technology (CSIST), serving as Research Assistant at the most basic level and then got promoted to Senior Scientist in 19 years. Then he went back to NCKU to start his teaching career and devoted the knowledge and practices he had learned in CSIST to the research domains of manufacturing automation and e-Manufacturing for industries such as semiconductor, TFT-LCD, solar cell, machine tool, and aerospace to help achieve the goals of enhancing the industry competitiveness by successfully improving manufacturing processes and lowering production cost. 
Professor Cheng’s research achievements are significant both academically and industrially in the domains of e-Manufacturing, Smart Manufacturing, and Industry 4.1. Among those, he has been taking the lead especially on the academic and practical applications of VM technologies. So far, he has more than 25 VM-related journal papers, dozens of VM invention patents both domestically and internationally, and 35 AVM-related technology transfers to high-tech industries like semiconductor (TSMC, UMC, ASE), TFT-LCD (CMI, AUO), solar cell (Motech) and traditional industries such as aerospace (AIDC) and machine tool (FEMCO) as well as foundations/associations like ITRI and MIRDC. In one word, he has exceptional contributions in both the academy and industries.

Some of Professor Cheng’s honors and awards include: 2011 Award for Outstanding Contributions in Science and Technology from the Executive Yuan, three times of National Science Council (NSC) Outstanding Research Award (2006, 2009, 2013), 2006 NSC Outstanding Industry-University Cooperation Award, 2012 National Invention and Creation Award—Gold Medal (System and Method for Automatic Virtual Metrology) of Ministry of Economic Affairs (MoEA), University-Industry Economic Contribution Award from MoEA, Industry-University Cooperation Award for College Teachers of Ministry of Education, NCKU Chair Professor since January 2009, 17th TECO Award from TECO Technology Foundation in 2010, 2014 Outstanding Research Award of Pan Wen Yuan Foundation, 2014 K.-T. Li Science and Humanities Chair, 2015 20th Outstanding Achievement Award of The Phi Tau Phi Scholastic Honor Society, 2016 Machinery Industry-University Contribution Award of Taiwan Association of Machinery Industry (TAMI), and 2016 Ministry of Science and Technology (MoST) Outstanding Technology Transfer Award (for enhancement and extending applications of AVM), as well as IEEE Fellow since January 2008, 2013 IEEE Inaba Technical Award for Innovation Leading to Production (for contributions to the development of the AVM System), two times of IEEE ICRA Best Automation Paper Award in 1999 and 2013, and IEEE CASE Best Application Paper Award in 2017. He was also the Program Chair of IEEE CASE 2014, the Award Chairs of both CASE 2016 and ICRA 2017, and the Lead Guest Editor of IEEE Transactions on Automation Science and Engineering (2014~2015).

 

Prof. Sujan Debnath, the Head of Mechanical Engineering, Curtin University, Malaysia

Speech Title: Closed Form Solutions of Interfacial Shearing and Peeling Stresses at Layered Structures in Electronic Packaging 

Abstract: The study of thermal mismatch induced interfacial stresses at layered structures and their role in structural and functional failure is one pertinent topic to electronic packaging and photonic applications. Therefore, an understanding of the nature of the interfacial stresses under different temperature conditions is necessary in order to minimize or eliminate the risk of mechanical failure. An accurate assessment of interfacial thermal stresses plays an important role in the design and reliability studies of microelectronic devices. In the microelectronic industry, from a practical point of view, there is a need for simple and powerful analytical models to determine interfacial stresses in layered structures quickly and accurately.

The present lecture will briefly review the previous work on the determination of interfacial thermal stresses. In the present work, the case of uniform temperature model of two layered structure has been extended to account for differential uniform temperatures as well as linear temperature gradient in the layers. The expression of shear stress compliance is defined to avoid contradictions by the earlier researchers. The influence of bond material and geometric properties on interfacial stresses is also considered in a simple way.

Finally, a simple and improved solution for tri layered structure subjected to uniform and differential uniform temperature in the layers is proposed by removing the short comings of the earlier model. The condition for bow free assembly is also discussed.

Biography: Dr. Sujan (CEng MIMechE) Joined Curtin University, Sarawak Malaysia in October 2008 after completion of two years tenure in Multimedia University, Malaysia. Since 2014, he has been appointed as the Head of Mechanical Engineering, Curtin Sarawak. Dr. Sujan obtained his PhD Degree from the University of Science Malaysia in 2006 majoring applied mechanics with specific research focuses on interfacial thermal mismatch stress analysis in layered structure. 

Over the years, he has been working in the area of thermo-mechanical stress analysis, green composite materials, and polymer composite materials. He has more than 65 publications in reputable international journals and conference proceedings. 

At present, Dr. Sujan is supervising four PhD and three MPhil students. Dr. Sujan is a Chartered Engineer and member of the Institute of Mechanical Engineers, UK.

Prof. Suksan Prombanpong, King Mongkut's University of Technology Thonburi (KMUTT), Bangkok, Thailand

Prof. Erween Abd Rahim, Universiti Tun Hussein Onn Malaysia, Malaysia

Dr. Erween Abd. Rahim, is a Associate Professor in the Faculty of Mechanical and Manufacturing Engineering at Universiti Tun Hussein Onn Malaysia, where he teaches graduate and undergraduate courses in manufacturing engineering. Dr. Erween holds undergraduate and graduate degrees from Universiti Teknologi Malaysia and Tokyo University of Agriculture and Technology, Japan, with specialization in machining process. Prior to joining academe, Dr. Erween spent 5 years with several manufacturing and business enterprises.

Dr. Erween has numerous publications in the areas of machining processes. He held the position of Head of Precision Machining Research Center since 2016. He is also the author of the Laser Dan Aplikasi Terkini ( Laser and Recent application) and Minyak Pelincir Berasaskan Tumbuhan (Vegetable-based Lubricant) books, both written in Malaysian language.

 

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